ipc标准
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2023年3月16日发(作者：聊聊后台)电子组装（Assembly）
IPC-T-50F
TermsandDefinitionforInterconnectingandPackaging
ElectronicCircuits
电子电路互连与封装的定义和术语
IPC-S-100
StandardsandSpecificationsManual
标准和详细说明汇编手册
IPC-E-500
IPCElectronicDocumentCollection
已出版的IPC标准电子文档资料合订本
IPC-TM-650
TestMethodsManual
试验方法手册
IPC-ESD-20-20
AssociationStandardfortheDevelopmentofanESDControl
Program
静电释放控制过程(由静电释放协会制定)
IPC/EIAJ-STD-001C
RequirementsforSolderedElectrical&ElectronicAssemblies
电气与电子组装件锡焊要求
IPC-HDBK-001
HandbookandGuidetoSupplementJ-STD-001—Includes
Amendment1
J-STD-001辅助手册及指南及修改说明1
IPC-A-610C
AcceptabilityofElectronicAssemblies
印制板组装件验收条件
IPC-HDBK-610
HandbookandGuidetoIPC-A-610(IncludesIPC-A-610BtoC
Comparison
IPC-610手册和指南(包括IPC-A-610B和C的对比)
IPC-EA-100-K
ElectronicAssemblyReferenceSet
电子组装成套手册，包括：IPC/EIAJ-STD-001C，IPC-
HDBK-001，IPC-A-610C。
IPC/WHMA-A-620
RequirementsandAcceptanceforCableandWireHarness
Assemblies
电缆和引线贴装的要求和验收
IPC/EIAJ-STD-012
ImplementationofFlipChipandChipScaleTechnology
倒装芯片及芯片级封装技术的应用
IPC-SM-784
GuidelinesforChip-on-BoardTechnologyImplementation
芯片直装技术实施导则
IPC/EIAJ-STD-026
SemiconductorDesignStandardforFlipChipApplications
倒装芯片用半导体设计标准
J-STD-027
MechanicalOutlineStandardforFlipChipandChipSize
Configurations
FC（倒装片）和CSP(芯片级封装)的外形轮廓标准
IPC/EIAJ-STD-028
PerformanceStandardforConstructionofFlipChipandChip
ScaleBumps
倒装芯片及芯片级凸块结构的性能标准
SMC-WP-003
ChipMountingTechnology
芯片贴装技术
J-STD-013
ImplementationofBallGridArrayandOtherHighDensity
Technology
球栅阵列(BGA)及其它高密度封装技术的应用
IPC-7095
DesignandAssemblyProcessImplementationforBGAs
球栅阵列的设计与组装过程的实施
IPC/EIAJ-STD-032
PerformanceStandardforBallGridArrayBalls
BGA球形凸点的标准规范
IT-98000
JPLChipScalePackagingGuidelines
JPL发布的CSP导则
注：IT(TheCaliforniaInstituteofTechnology)
JPL(TheJetPropulsionLaboratory)
IT-98080
JPLBallGridArrayPackagingGuidelines
JPL发布的BGA封装导则
IT-98093
ITRIChipCarrier,Phase1Report
ITRI关于芯片载体的报告
ITRI(TheInterconnectTechnologyResearchInstitute)
IPC-MC-790
GuidelinesforMultichipModuleTechnologyUtilization
多芯片组件技术应用导则
IPC-M-108
CleaningGuidesandHandbookManual
清洗导则和手册
IPC-TP-1113
CircuitBoardIonicCleanlinessMeasurement:WhatDoesItTell
Us?
电路板离子洁净度测量：它告诉我们什么？
IPC-CH-65A
GuidelinesforCleaningofPrintedBoards&Assemblies
印制板及组装件清洗导则
IPC-SC-60A
PostSolderSolventCleaningHandbook
锡焊后溶剂清洗手册
IPC-SA-61
PostSolderSemi-aqueousCleaningHandbook
锡焊后半水溶剂清洗手册
IPC-AC-62A
AqueousPostSolderCleaningHandbook
锡焊后水溶液清洗手册
IPC-TR-476A
ElectrochemicalMigration:ElectricallyInducedFailuresin
Printed
CircuitAssemblies
电化学迁移：印制电路组件的电气诱发故障
IPC-TR-580
CleaningandCleanlinessTestProgramPhase1TestResults
清洗及清洁度试验计划1阶段试验结果
IPC-TR-582
CleaningandCleanlinessTestProgramfor:Phase3--Low
Solids,FluxesandPastesProcessedinAmbientAir
IPC第3阶段非清洗助焊剂研究
IPC-TR-583
AnIn-DepthLookAtIonicCleanlinessTesting
深入离子洁净度测试
IPC-9201
SurfaceInsulationResistanceHandbook
表面绝缘电阻手册
IPC-TP-104K
Cleaning&CleanlinessTestProgram,Phase3WaterSoluble
Fluxes,
Part1&Part2第3阶段水溶性助焊剂清洗，第一和第二部
分
IPC-M-109
ComponentHandlingManual
元件处理手册
IPC/JEDECJ-STD-020B
Moisture/ReflowSensitivityClassificationforNonhermetic
SolidStateSurfaceMountDevices
非密封固态表面贴装器件湿度／再流焊敏感度分类
IPC/JEDECJ-STD-033A
Handling,Packing,ShippingandUseofMoisture/Reflow
SensitiveSurfaceMountDevices
对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使
用
IPC/JEDECJ-STD-035
AcousticMicroscopyforNon-HermeticEncapsulatedElectronic
Components
非气密封装电子元件用声波显微镜
IPC-9500-K
Setoffourdocuments9501-9504
9501至9504手册合订本
IPC-DRM-18F
ComponentIdentificationDeskReferenceManual
零件分类标识手册
IPC-DRM-SMT-C
SurfaceMountSolderJointEvaluationDeskReferenceManual
接插件焊接点评价手册
IPC-DRM-40E
Through-HoleSolderJointEvaluationDeskReferenceManual
接插件焊接点评价手册
IPC-DRM-56
WirePreparation&CrimpingDeskReferenceManual
导线和端子预成形参考手册
IPC-DRM-53
IntroductiontoElectronicsAssemblyDeskReferenceManual
电子组装基础介绍手册
IPC-M-103
StandardsforSurfaceMountAssembliesManual
所有SMT标准合订本
IPC-M-104
StandardsforPrintedBoardAssemblyManual
10种常用印制板组装标准合订本
IPC-TA-722
TechnologyAssessmentofSoldering
锡焊技术精选手册
IPC-TA-723
TechnologyAssessmentHandbookonSurfaceMounting
表面安装技术精选手册
IPC-TA-724
TechnologyAssessmentSeriesonCleanRooms
清洁室技术精选系列
IPC-SM-780
ComponentPackagingandInterconnectingwithEmphasison
SurfaceMounting
以表面安装为主的元件封装及互连导则
IPC-SM-785
GuidelinesforAcceleratedReliabilityTestingofSurfaceMount
Attachments
表面安装焊接件加速可靠性试验导则
IPC-PD-335
ElectronicPackagingHandbook
电子封装手册
IPC-7525
StencilDesignGuidelines
网版设计导则
IPC-TR-581
IPCPhaseIIIControlledAtmosphereSolderingStudy
IPC第3阶段受控气氛焊接研究
IPC-MI-660
IncomingInspectionofRawMaterialsManual
原材料接收检验手册
IPC/EIAJ-STD-004
RequirementsforSolderingFluxes-IncludesAmendment1
锡焊焊剂要求（包括修改单1）
IPC/EIAJ-STD-005
RequirementsforSolderingPastes-IncludesAmendment1
焊膏技术要求（包括修改单1）
IPC-HDBK-005
GuidetoSolderPasteAssessment
焊膏性能评价手册
IPC/EIAJ-STD-006A
RequirementsforElectronicGradeSolderAlloysandFluxed
andNon-FluxedSolidSolders电子设备用电子级锡焊合金、
带焊剂及不带剂整体焊料技术要求
IPC-SM-817
GeneralRequirementsforDielectricSurfaceMounting
Adhesives
表面安装用介电粘接剂通用要求
IPC-CA-821
GeneralRequirementsforThermallyConductiveAdhesives
导热胶粘剂通用要求
IPC-3406
GuidelinesforElectricallyConductiveSurfaceMount
Adhesives
表面贴装导电胶使用指南
IPC-3408
GeneralRequirementsforAnisotropicallyConductive
AdhesivesFilms
各向异性导电胶膜的一般要求
IPC-CC-830B
QualificationandPerformanceofElectricalInsulating
CompoundforPrintedWiringAssemblies
印制板组装电气绝缘性能和质量手册
IPC-HDBK-830
GuidelineforDesign,SelectionandApplicationofConformal
Coatings
敷形涂层的设计，选择和应用手册
IPC-SM-840C
QualificationandPerformanceofPermanentSolderMask-
IncludesAmendment1
永久性阻焊剂的鉴定及性能(包括修改单1)
IPC-HDBK-840
GuidetoSolderPasteAssessment
焊膏性能评价手册
IPC-TP-1114
TheLayman’sGuidetoQualifyingaProcesstoJ-STD-001
基于J-STD-001组装工艺雷氏选择法
IPC-TR-467
SupportingData&NumericalExamplesforJ-STD-001(Control
ofFluxes)
J-STD-001(焊剂控制)的支持数据及数字实例
IPC-AJ-820
Assembly&JoiningHandbook
装联手册
IPC-7530
GuidelinesforTemperatureProfilingforMassSoldering
(Reflow&Wave)Processes
大规模焊接(回流焊与波峰焊)过程温度曲线指南
IPC-9701
PerformanceTestMethodsandQualificationRequirementsfor
SurfaceMountSolderAttachments
表面安装锡焊件性能试验方法与鉴定要求
IPC-TP-1090
TheLayman’sGuidetoQualifyingNewFluxes
新型助焊剂雷氏选择法
IPC-TP-1115
SelectionandImplementationStrategyforaLow-ResidueNo-
CleanProcess
低残留不清洗工艺的选择和实施
IPC-S-816
SMTProcessGuideline&Checklist
表面安装技术过程导则及检核表
IPC-TR-460A
Trouble-ShootingChecklistforWaveSolderingPrintedWiring
Boards
印制板波峰焊故障排除检查表
IPC-CM-770D
ComponentMountingGuidelinesforPrintedBoards
印制板元件安装导则
IPC-7912
CalculationofDPMO&ManufacturingIndicesforPrinted
BoardAssemblies
印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的
计算
IPC-9261
In-ProcessDPMOandEstimatedYieldforPWAs
印制板组装过程中每百万件缺陷数(DPMO)及合格率估计
IPC-9501
PWBAssemblyProcessSimulationforEvaluationofElectronic
Components电子元件的印制板组装过程模拟评价
IPC-9502
PWBAssemblySolderingProcessGuidelineforElectronic
Components
电子元件的印制板组装焊接过导则
IPC-9503
MoistureSensitivityClassificationforNon-ICComponents
非集成电路元件的湿度敏感度分级
IPC-9504
AssemblyProcessSimulationforEvaluationofNon-IC
Components(PreconditioningNon-ICComponents)
非集成电路元件的组装过程模拟评价（非集成电路元件预处
理）
IPC-9850-K
SurfaceMountPlacementEquipmentCharacterization-KIT
表面贴装设备性能检测方法的描述（附Gerber格式CD
盘）
IPC-9850-TM-KW,IPC-
9850-TM-K
TestMaterialsKitforSurfaceMountPlacementEquipment
Standardization
表面贴装设备性能测试用的标准工具包
•4IPC-9850PlacementAccuracyVerificationPanels
•1IPC-9850CMMMeasurementVerificationPanels
•150IPC-9850QFP-100GlassComponents
•130IPC-9850QFP-208GlassComponents
•150IPC-9850BGA-228GlassComponents
•NISTTraceableMeasurementCertificate
•CustomStorageCase
IPC-7711/217711&7721
Package
合订本
IPC-7711
ReworkofElectronicAssemblies
电子组装件的返工
IPC-7721
RepairandModificationofPrintedBoardsandElectronic
Assemblies
印制板和电子组装件的修复与修正
IPC/EIAJ-STD-002B
SolderabilityTestsforComponentLeads,Terminations,Lugs,
TerminalsandWires
元件引线、端子、焊片、接线柱及导线可焊性试验
IPC/EIAJ-STD-003
SolderabilityTestsforPrintedBoards
印制板可焊性试验
IPC-TR-461
Trouble-ShootingChecklistforWaveSolderingPrintedWiring
Boards
印制板波峰焊故障排除检查表
IPC-TR-462
SolderabilityEvaluationofPrintedBoardswithProtective
CoatingsOverLong-termStorage
带保护性涂层印制板长期贮存的可焊性评价
IPC-TR-464
AcceleratedAgingforSolderabilityEvaluations
可焊性加速老化评价(附修订)
IPC-TR-465-1
RoundRobinTestonSteamAgerTemperatureControlStability
蒸汽老化器温度控制稳定性联合试验
IPC-TR-465-2
TheEffectofSteamAgingTimeandTemperatureon
SolderabilityTestResults
蒸汽老化时间与温度对可焊性试验结果的影响
IPC-TR-465-3
EvaluationofSteamAgingonAlternativeFinishes,PhaseIIA
替代涂覆层的蒸汽老化评价
IPC-TR-466
TechnicalReport:WettingBalanceStandardWeight
ComparisonTest
技术报告:润湿天平称重标准对比测试
SMC-WP-001
SolderingCapabilityWhitePaperReport
可焊性工艺导论
SMC-WP-005
PCBSurfaceFinishes
印制电路板表面清洗
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